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Product Info
In-line sputter
In-line plasma cleaner
Batch coater
O E M
Decoration coating
Anti-EMI coating

Mg-Al alloy coating

BGA substrate coating

Plasma cleaning

   
 
 
In-Line Sputter
 


Product portfolio

Modle L17 L20 L24 L30 L40
Chamber #* 6∼9 6∼9 6∼9 6∼9 11∼13
Heater Optional Optional Optional Optional Optional
Pre-clean Optional Optional Optional Optional Optional
Target Size*
(LxWxH):inch
17"x5"
*0.5"
20"x5"
*0.5"
24"x5"
*0.5"
30"x5"
*0.5"
40"x5"
*0.5"
Carrier Size*
(LxW):mm
570x
420
570x
420
550x
600
700x
610
1200x
1000


* Custom design available.

General Configuration

Single-end type*

Single-end type*


Double-end type*

*Custom design available.

● Pumping System:
  Low Vacuum: Dry Pump, Root's Pump + Booster Pump
  High Vacuum: Cryo Pump, Turbo Pump, Diffusion Pump
● Options:
   De-Gas
   Plasma Clean
   High Vacuum Buffer Chamber

● Process Capability
   DC Sputter (Metal, ITO)
   RF Sputter (Oxide)
   MF sputter (reactive, SO2)

● Control System:
  PLC + iPC
   Adjustable carrier dynamic speed
   Adjustable pass number of coatings
   Adjustable gas type and flow rate

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No 128, 1 Rd, Taichung Industrial Park, Taiwan (407) .
TEL:886-4-23507301 / FAX:886-4-23507303