Linco Technology Co., Ltd.

Milestones

2021 In the Top 2000 Survey-Manufacturing Survey, CommonWealth Magazine placed LINTOTECH 12th among the 50 fastest-growing firms in 2021.
Won the 8th Dun & Bradstreet SME Elite Award in 2021
Dielectric layer thinning down at panel level (600x600 mm) for advanced packaging.
The 4th generation PVD coating equipment for Sip conformal shielding
2020 Won the ASE Group's "2020 Outstanding Strategic Partner" award.
RDL (500x600 mm) coating equipment for advanced packaging.
Heat dissipation subatrate for surface emitting laser (SEL)/vertical-cavity surface-emitting laser (VCSEL)
Insulated heat dissipation substrate for high-power modules.
2019 BSM (300 x 300 mm) coating equipment for advanced packaging.
Panel level (300 x 300 mm) etching equipment for advanced packaging.
2018 Optical gradient coating equipment for mobile terminals.
R2R coating equipment for flexible CIGS solar cells.
PVD coating equipment for automotive trims.
2017 Coating equipment for passive components.
Automated solutions for flexible CIGS solar cells.
2016 The 3rd generation sputtering equipment for conformal shielding
SiP conformal shielding automation solutions
Magnetic material planar target sputtering source technology
2015 Acquired premises and headquartered LINCO Group Companies in Central Technology Science Park (CTSP) Taichung
3rd generation semiconductors SIP EMI conformal shielding sputtering tool-CORONA family C3330 mass production for smart phone application
2014 2nd generation semiconductors SIP EMI conformal shielding sputtering tool-CORONA family C3200/C3300 mass production for smart phone application
2013 Taoyuan premise leased for fast assembly mid/Large-size Touch panel sputtering tool TUCANA Family T4000H-AS
Thin-film antena sputtering process successfully developed for replacement current more expensive LDS process
2012 Established "Lincotec (Shanghai) Technology Co., Ltd."
2010 Patent granted, No. M375082, "Unit of Inner Transfer Quick-Detachable System
Patent granted, No. M375711, "Inner Quick-Detachable System Assemble Using The Same
Patent granted, No. M384399, " Horizontal in-line Sputter with Index Transfer
Listed on OTC (3644-tw).
2009 Patent granted, No. M 349929, " Fixed Inner Transfer System Using The Same
Patent granted, No. M 350092, "3D Rotation System Of Sputtering Apparatus
Patent granted, No. M 355951, "Sputtering Apparatus Condensation System
Patent granted, No. M 355952, "Adjustable Rotation Tool Of Batch Sputtering Apparatus
Patent granted, No. M 356742, "Inner Transfer System Using The Same
Award of Deloitte: Technology Fast 500 in Asia Pacific 2009.
Established " KUNSHAN CONCORD Technology Co., Ltd."
2008 Introduced sputter into Touch Panel industry.
1st Decoration sputter sold to Japan.
Approved by SFB to offer publicly company share.
"SEMI S2" certification.
Patent granted, No. M 345705, "High Resistance and High Gloss Coating Structure on Non-conductive Substrate
2007 Patent granted,No.095218488,for "Light Emitting Diode Carrier Structure".
Introduced EMI coating of NB and 3C housing using the in-line sputtering system.
EMI coating for Megapixel grade lens holder.
2006 ISO 14001 certified and completed development of NCVM technology.
2005 Released 2nd generation In-Line Plasma and sputtering system.
Established specialist contract sputtering group.

2004 Patent granted, No. 221689, for "Corona Discharge Treatment Equipment ".
2003 ISO 9001 certified.
Patent granted, No. 214096, for "Multi-Layer Key Structure".
Introduced reflector coating using in-line sputtering for the optoelectronics industry.
2002 Introduced IMD (In-Mold Decorating) and SDC (Surface Decoration Coating) using the in-line sputtering process. This has been certified by customers in the mobile phone industry.
Introduced in-line sputtering process for the 3C industry.
Patent granted, No. 186176, for "Protective Coating Device for Electromagnetic Interference ".
2001 Developed in-house design Roll-to-Roll sputtering system.
2000 Developed in-house design low-temperature in-line sputtering system.
Developed in-house design manufacturing process for EMI shielding.
1999 Lincotec Co. established.