SEMICONDUCTOR & IC PACKAGING

Application:
- Desmear & Metallization
Substrate:
- Material: IC substrate
- Dimension: 16"X20" ; 20"x20" ; 20"x24"
Degas module:
- substrate temperature up to 200℃
Plasma treatment module:
- Surface activation & cleaning
- Demear / Descum
- Plasma etching
Sputtering module:
- Planar magnetron
- Thickness uniformity: <±5%
- uniformity of R&R: <±3%

Application:
- Conformal shielding or passivation
Substrate:
- Material: SiP module
Carrier:
- Dimension: 570x650 mm2
Degas module:
- Substrate temperature up to 200℃
Plasma treatment module:
- Surface activation & cleaning
Sputtering module:
- Planar magnetron
- Thickness uniformity:<+-5%
- Uniformity of R&R:<+-3%